Henkel Introduces New 2-in-1 Die-Attach Film

8/19/2012 11:47 AM 


Loctite Ablestik CDF 200P is Henkel's new precut combination of dicing film and conductive die-attach film. According to the manufacturer, this technology enables new device designs that demand thinner die and more die per package. Loctite Ablestik CDF 200P is a pre-cut film, available for 6-in. or 8-in. wafers. Its predecessor, Loctite Ablestik C100, is a conductive die-attach film in roll format.

According to Henkel, prior to its introduction of electrically conductive die-attach films, the benefits of film technology were only available for laminate-based packages. But the company’s development of Loctite Ablestik C100 in 2010 opened the door for leadframe device manufacturers to leverage the advantages of die-attach film, which include consistent, uniform bondlines, elimination of die tilt, and the ability to incorporate ultra-thin wafers. In addition, because films eliminate the fillet associated with paste-based materials, they allow more die-per-package due to tighter die-to-pad clearance. Leadframe semiconductor specialists now have the option of using Henkel’s roll format Loctite Ablestik C100 or its new pre-cut, two-in-one (dicing tape and die-attach film combination) Loctite Ablestik CDF 200P conductive die attach films, thereby enabling package design scalability not possible with conventional die-attach materials.

Compatible with lamination equipment commonly used in the field, Loctite Ablestik CDF 200P does not require additional capital equipment investment. With a lamination temperature of 65 degrees Celsius, the novel material complies with most existing equipment and processes for both lamination and backgrinding. Additionally, its two-in-one dicing tape and die-attach film combination streamlines manufacturing by facilitating an in-line process for thin wafers and a single lamination process in one, combined step.

Proven effective on a wide range of die sizes (from 0.2 mm x 0.2 mm to 5.0 mm x 5.0 mm), a variety of wafer metallizations including bare silicon, TiNiAg and Au, and multiple leadframe metallizations such as Cu, Ag and Au, Loctite Ablestik CDF 200P is designed to offer superior process adaptability. The material also delivers high reliability, having been MSL-1-qualified with several package designs that include SO (SOT and SOD), QFN (DFN) and even smaller-die QFP devices.